Huawei plans to begin mass-producing its Ascend 910C AI chip in early 2025, despite ongoing struggles to achieve sufficient production yields due to US trade restrictions. The Chinese telecom giant has already sent samples to tech firms and started taking orders for the chip, designed to rival Nvidia’s high-performance processors. The company faces significant challenges, as restrictions on advanced manufacturing technologies have limited its chip-making efficiency.
The Ascend 910C is produced by Semiconductor Manufacturing International Corp (SMIC) using an N+2 process but suffers from a yield of just 20%—far below the 70% required for commercial viability. Previous Huawei processors, including the 910B, achieved yields of around 50%, leading to delays in fulfilling orders from major clients like ByteDance. Washington’s restrictions, which prevent access to critical Dutch lithography equipment, have further constrained China’s ability to produce advanced semiconductors.
Huawei’s reliance on SMIC has been costly, with chips produced on its advanced nodes priced up to 50% higher than alternatives. While the company has sought supplemental production from Taiwan’s TSMC, US authorities have tightened export controls, limiting access to cutting-edge chips and forcing Huawei to prioritise strategic government and corporate orders. The escalating trade tensions underscore the geopolitical struggle between the US and China over technological dominance, with both nations doubling down on policies to secure their interests.
As Beijing pushes for self-reliance in semiconductors, Huawei’s production challenges reflect the broader impact of US restrictions on China’s tech sector. With further curbs on the horizon, Huawei’s success in advancing its AI chips may shape the next phase of the US -China tech rivalry.
California-based AI startup Enfabrica has raised $115M in a funding round to tackle one of the field’s most pressing challenges, enabling vast networks of AI chips to work seamlessly at scale. The company, founded by former engineers from Broadcom and Alphabet, plans to release its new networking chip early next year. This chip aims to enhance efficiency by addressing bottlenecks in how AI computing chips interact with networks, a problem that slows down data processing and wastes resources.
The startup claims its technology can scale AI networks to connect up to 500,000 chips, significantly surpassing the current limit of around 100,000. This breakthrough could speed up the training of larger AI models, reducing time and costs associated with unreliable or inaccurate outcomes. “The attributes of the network, like bandwidth and resiliency, are critical for scaling AI efficiently,” said Enfabrica CEO Rochan Sankar.
Investors in the funding round included Spark Capital, Maverick Silicon, and corporate backers like Arm Holdings and Samsung Ventures. Nvidia, an industry leader in AI chips, also participated, signaling strong support for Enfabrica’s mission to optimise AI infrastructure.
Silicon Valley firm d-Matrix has launched its first AI chip, designed to enhance AI services like chatbots and video generators. Early samples are being tested by customers, with full-scale shipments expected next year.
The chip focuses on inference tasks, allowing multiple users to interact simultaneously with AI systems, such as generating or modifying videos. d-Matrix’s innovation aims to complement market leaders like Nvidia by specialising in real-time user requests.
Backed by over $160 million in funding, including from Microsoft‘s venture arm, the company has partnered with Super Micro Computer to offer servers equipped with its chips. CEO Sid Sheth highlights strong demand in video applications for multi-user interactions.
With AI adoption surging, data centers are bracing for a 160% jump in electricity consumption by 2030, driven by the energy demands of GPUs. Sagence AI, a startup led by Vishal Sarin, is addressing this challenge by developing analog chips that promise greater energy efficiency without sacrificing performance.
Unlike traditional digital chips, Sagence’s analog designs minimise memory bottlenecks and offer higher data density, making them a viable option for specialised AI applications in servers and mobile devices. While analog chips pose challenges in precision and programming, Sagence aims to complement, not replace, digital solutions, delivering cost-effective and eco-friendly alternatives.
Backed by $58M in funding from investors like TDK Ventures and New Science Ventures, Sagence plans to launch its chips in 2025. As it scales operations, the startup faces stiff competition from industry giants and will need to prove its technology can outperform established systems while maintaining lower energy consumption.
SilTest Semiconductors GmbH and yieldWerx have announced a strategic partnership to optimise European semiconductor yield. That collaboration combines SilTest’s engineering expertise with yieldWerx’s advanced data analytics software, offering semiconductor manufacturers an integrated, data-driven solution for improving production efficiency, optimising yields, and reducing costs.
Specifically, the partnership provides a seamless approach to yield management, addressing critical industry needs by facilitating faster troubleshooting, streamlining testing processes, and offering actionable insights from production data. Furthermore, with SilTest’s presence in Europe, clients benefit from localised support tailored to the specific needs of the European semiconductor market.
In addition, both companies emphasise their commitment to supporting the semiconductor industry with innovative solutions and expert guidance. By merging their strengths, SilTest and yieldWerx aim to empower European semiconductor companies to achieve their yield and efficiency goals, thus driving growth and technological advancement within the industry. Ultimately, this collaboration underscores their dedication to providing cutting-edge tools, region-specific expertise, and deeper insights into yield optimisation, helping clients navigate the challenges of the semiconductor market.
The Korea Fair Trade Commission (FTC) has announced its intention to closely monitor mergers and acquisitions (M&As) in the rapidly growing AI semiconductor sector to assess potential anti-competitive effects. With the increasing pace of technological advancements and the rising demand for AI technologies, the FTC recognises that M&As could significantly impact market competition, particularly by reducing the number of players in the industry.
Given the sector’s dynamic nature and the challenges posed by factors like the US-China tech rivalry, the FTC’s role is crucial in ensuring that these business combinations do not result in unfair market practices, such as price increases or the exclusion of competitors. Therefore, through careful scrutiny of M&As, the FTC aims to preserve healthy competition, support technological innovation, and protect the overall market ecosystem.
In addition, the Korea Fair Trade Commission (FTC) is reviewing several significant mergers, including combining Synopsys and Ansys and acquiring ZT Systems by AMD. These deals could profoundly impact the AI semiconductor market, especially regarding access to essential design software and hardware technologies.
To enhance its understanding of the potential anti-competitive effects of these M&As, the FTC is gathering input from industry experts and academic leaders. This collaborative approach, including forums like the ‘AI Semiconductor-Related Business Combination Forum,’ helps the FTC stay informed about emerging trends and refine its strategies for safeguarding fair competition in the rapidly evolving AI semiconductor sector.
Global semiconductor sales surged in Q3 2024, with a 23.2% year-over-year growth and a 10.7% quarter-over-quarter increase, fueled by rising demand from industries like AI, big data, and electric vehicles. Countries around the world, including China, the US, and the EU, are investing heavily in semiconductor development to secure a competitive edge in the global chip market.
The EU is focusing on photonic technology, committing €133 million to establish a photonic integrated circuit (PIC) pilot line in the Netherlands by 2025. This initiative aims to enhance Europe’s position in the growing photonic chip market, driven by the demand for more efficient data transmission for cloud computing and AI applications.
Japan has also made a significant move, announcing a ¥10 trillion ($65 billion) investment by 2030 to support its semiconductor and AI industries. This funding is part of a broader strategy to boost chip production and innovation, with a focus on the collaboration between Rapidus, IBM, and Belgium’s Imec.
South Korea is ramping up its semiconductor support through a proposed Semiconductor Special Act, which includes financial backing and workweek exemptions for semiconductor manufacturers. The bill reflects the country’s commitment to strengthening its semiconductor industry, with plans for a ₩26 trillion funding initiative and an ₩800 billion fund to support the semiconductor ecosystem by 2027.
Global semiconductor manufacturers are accelerating their shift from China to Vietnam, driven by the anticipated intensification of US sanctions on China’s semiconductor industry, especially with the return of Donald Trump to the White House. South Korean firms, including Samsung Electronics and SK Hynix, are leading this transition, halting production expansions in China and focusing investments on Vietnam, which has become a rising hub for semiconductor production.
SK Hynix, for instance, shelved plans to increase DRAM chip production at its Wuxi plant in China, while Samsung Electronics is cutting back on production at its NAND flash memory facility in Xi’an. Other companies are also following suit; South Korea’s Hana Micron is expanding its presence in Southeast Asia, and Amkor Technology is investing $1.6 billion in a new semiconductor packaging plant in Vietnam. The facility will feature advanced technology, with some equipment reportedly transferred from China.
Vietnam’s semiconductor industry is also benefiting from the growth of companies like Samsung, which established a $1.7 billion OLED plant in the country. Samsung’s semiconductor division is reportedly boosting its investments in Vietnam, encouraging further expansions from supporting companies. Semiconductor testing and packaging firm Signetics is set to invest $100 million in a new facility in Vietnam, and German company Infineon is considering setting up an R&D center in Hanoi.
This shift underscores the ongoing global realignment in the semiconductor industry as companies adapt to geopolitical tensions and US-China trade policies.
Taiwan President Lai Ching-te has called for an economic partnership agreement with the European Union, emphasising the need for collaboration in semiconductors and shared democratic values. Speaking at a Taiwan-EU investment forum in Taipei, Lai highlighted the importance of secure supply chains and stronger ties to counter growing authoritarian threats.
The EU, under its European Chips Act, has sought to deepen cooperation with Taiwan to boost semiconductor production and reduce reliance on Asia. Taiwan Semiconductor Manufacturing Co.’s (TSMC) new chip plant in Dresden, Germany, underscores Taiwan’s role in strengthening European industry and supply chains.
While Maria Martin-Prat of the European Commission praised Taiwan as a trusted economic partner in her video address to the forum, she did not mention plans for a formal agreement. Taiwan, diplomatically isolated from most global organisations, has been pursuing trade deals with like-minded partners, recently securing an Enhanced Trade Partnership with Britain and seeking membership in the CPTPP.
The United Kingdom is sending its first trade delegation focused on AI and semiconductors to Kolkata on 18-19 November 2024. Seventeen leading British organisations specialising in technological innovation will take part in the two-day mission.
A key goal is to explore business opportunities in West Bengal and eastern India, fostering partnerships between British companies and Indian stakeholders. The initiative is aimed at bolstering collaboration in AI and semiconductor research, development, and manufacturing, addressing the growing demand in these sectors.
Andrew Fleming, the British Deputy High Commissioner to East and North-East India, expressed enthusiasm for the initiative, highlighting the potential for new partnerships. He emphasised the strengthening ties between the UK and India in the technology sphere, particularly in East and Northeast India, as key drivers for this mission.
Activities during the visit include roundtable discussions, networking events, and Business-to-Business meetings. Organised by the British Deputy High Commission in Kolkata in partnership with NASSCOM and Asterix Innovations, the engagements aim to identify opportunities for collaboration, innovation, and investment, paving the way for expanded cooperation between the UK and India.
