Industry group SEMI Europe has urged the incoming European Commission to adopt a more unified industrial strategy and expand on the existing European Chips Act. The group highlighted the importance of Mario Draghi’s recommendations, including a centralised EU budget and expedited approvals for strategic high-tech initiatives, to maintain competitiveness against the US and China.
SEMI emphasised the need for additional funding to bolster Europe’s semiconductor ecosystem, particularly in light of global export restrictions on chip technology and critical minerals. Quick action on EU export policies is vital to protect strategic interests and strengthen Europe’s global influence, the group said.
While the Chips Act focuses on attracting new manufacturing, SEMI and other industry voices, like ESIA, have called for broader support. This includes incentives for ‘legacy and foundational’ chip production and innovations essential for Europe’s green transition. Together, SEMI and ESIA represent leading players such as ASML, Infineon, and STMicroelectronics.
A revamped Chips Act would not only counter state-subsidised competition from China but also enhance Europe’s semiconductor supply chain resilience, crucial for its economic and technological independence.
The German government is preparing substantial investments to strengthen its semiconductor industry, aiming to reduce reliance on Asian suppliers and foster local innovation. Subsidies are expected to reach approximately €2 billion, although the Economy Ministry has described the figure as ‘low single-digit billions’. Funding applications for projects contributing to a sustainable microelectronics ecosystem have been invited following the European Chips Act.
The European Chips Act, a broader EU initiative, promotes local semiconductor production by subsidising advanced chip factories. Germany‘s funding prioritises modern production capacities that surpass current technological standards. Officials hope the move will bolster both national and European resilience in semiconductor manufacturing.
Efforts reflect a growing urgency to diversify the global semiconductor supply chain. Germany’s strategic push aligns with wider EU goals to establish a competitive, sustainable microelectronics industry capable of reducing dependence on foreign suppliers.
China has issued a strong warning against potential new US export restrictions on semiconductor technology, signalling it could take ‘necessary actions’ to safeguard its firms. The warning follows reports suggesting the Biden administration may expand its trade blacklist, potentially adding up to 200 Chinese chip companies to the list. Such measures would limit US suppliers from trading with these firms.
Chinese commerce ministry spokesperson He Yadong condemned the US for what he described as overreach in the name of national security. He argued the proposed controls destabilise global trade and harm bilateral cooperation in the semiconductor sector. He emphasised China’s determination to defend its companies’ rights if the US persists with its actions.
Reports indicate that the Biden administration is mulling restrictions on semiconductor equipment and AI memory chip sales to China. These measures may target firms like Semiconductor Manufacturing International Corp., a Huawei ally, while sparing ChangXin Memory Technologies, a rising AI memory chip developer.
The tensions come as the outgoing Biden administration faces domestic and international scrutiny over trade policies. Meanwhile, there is concern that President-elect Donald Trump’s proposed tariffs on Chinese goods could further inflame trade relations, with Beijing warning that such measures would fail to address US domestic issues effectively.
European chip equipment stocks surged on Thursday following reports that upcoming US restrictions on China’s semiconductor industry might be less stringent than anticipated. Shares of ASML, a leading supplier of semiconductor tools, rose by 4.3%, while competitors BE Semiconductor and ASM International climbed 5% and 2.9%, respectively, outperforming the STOXX 600 index.
According to Bloomberg, the US may exclude Chinese memory chipmaker ChangXin Memory Technologies (CXMT) from its trade restrictions, though details remain uncertain. The US Commerce Department, which oversees export rules, is expected to release updated guidance after Thanksgiving.
ASML, which has seen a sharp decline in sales to China over recent quarters, declined to comment. The company previously projected that sales to China would shrink to 20% of its revenue by 2025, down from nearly half in the last 18 months. Other global semiconductor equipment suppliers, including US-based Applied Materials and Tokyo Electron, are also closely monitoring the situation.
Intel has secured a $7.86 billion subsidy from the US Commerce Department to bolster its domestic semiconductor production. The revised figure is lower than the $8.5 billion initially announced in March, following Intel’s receipt of a $3 billion Pentagon award. The funding will support key projects in Arizona, New Mexico, Ohio, and Oregon, advancing the nation’s chip-making capabilities.
Commerce Secretary Gina Raimondo highlighted the deal as a step towards revitalising US manufacturing. She emphasised the importance of having American-designed chips produced domestically, benefiting national security and economic growth. Intel will receive at least $1 billion of the subsidy by the year’s end, having met key project milestones.
The grant is part of a broader $52.7 billion initiative under the 2022 CHIPS Act, aimed at strengthening the US semiconductor industry. While Intel declined an $11 billion low-cost loan offered earlier, the company plans to leverage a 25% Treasury Investment Tax Credit for investments exceeding $100 billion. Intel CEO Pat Gelsinger noted bipartisan support for the sector’s growth, calling it vital for America’s future.
The award comes with strict conditions, including a five-year prohibition on stock buybacks and requirements to share excess profits. Raimondo reassured that these safeguards are designed to protect taxpayers, with additional awards expected in the coming weeks.
The United StatesCommerce Department has announced nearly $60 million in subsidies for BAE Systems and Rocket Lab to boost semiconductor production crucial for aerospace and space technologies. BAE will receive $35.5 million to quadruple the production of chips used in F-35 fighter jets and satellites, cutting its modernisation timeline significantly.
Rocket Lab’s SolAero Technologies will receive $23.9 million to expand solar cell production by 50% over three years. These space-grade semiconductors power key missions, including NASA’s Artemis programme and the James Webb Space Telescope.
The investments are part of the Biden administration’s $52.7 billion ‘Chips and Science‘ programme aimed at bolstering domestic semiconductor manufacturing.
South Korea announced plans to provide 14 trillion won ($10 billion) in low-interest loans next year to support its chip sector amid growing competition from China and uncertainty over US trade policies under President-elect Donald Trump. The funds, managed by state-run banks, will include 1.8 trillion won for infrastructure like power lines at a new high-tech chip complex in Yongin and Pyeongtaek, designed to attract advanced chipmakers.
The government highlighted challenges posed by rapid advancements in China’s semiconductor industry and potential changes to US policies like the Inflation Reduction Act and Chips Act, which could alter global trade incentives. Trump has also pledged new tariffs on goods from China, Mexico, and Canada, raising additional concerns for South Korean exporters.
While South Korea leads in memory chip manufacturing through giants like Samsung Electronics and SK Hynix, it faces setbacks in chip design and contract manufacturing, where rivals are gaining ground. The government vowed to use all available resources to help the industry overcome its current challenges and maintain global competitiveness.
Samsung Electronics made significant leadership changes on Wednesday, aiming to strengthen its position in the competitive AI chip market. Semiconductor chief Jun Young-hyun was named co-CEO, gaining direct control of the struggling memory chip business, while US chip head Han Jin-man was promoted to lead the foundry division. The moves reflect Samsung’s strategy to address declining profits and regain its edge against rivals SK Hynix and Taiwan’s TSMC.
The reshuffle comes amid growing investor concerns over Samsung’s lagging performance in AI chip supply, particularly to key client Nvidia. Samsung’s semiconductor profits dropped sharply in the third quarter, attributed to delays with a major customer. Despite some progress since, analysts remain sceptical about the leadership structure, with Chung Hyun-ho retaining his influential role in the Business Support Task Force.
Chairman Jay Y. Lee acknowledged public and investor concerns during a hearing this week, emphasising the need to navigate business uncertainty and intensifying competition, particularly from Chinese chipmakers. Samsung hopes the leadership overhaul will drive innovation and stabilise its chip business in a rapidly evolving market.
Qualcomm’s interest in acquiring Intel has reportedly cooled due to the complexities involved in such a massive deal, according to Bloomberg. While a full acquisition now appears unlikely, Qualcomm may consider pursuing specific parts of Intel’s business or revisiting the idea in the future. Neither company has commented publicly on the report.
Qualcomm initially approached Intel in September, sparking speculation about a potential acquisition. Any deal would face significant antitrust scrutiny as it would unite two of the semiconductor industry’s biggest players. Qualcomm had previously explored acquiring sections of Intel’s design business, but no formal offer materialised.
Intel, once a dominant chipmaking powerhouse, has struggled in recent years, losing market share to competitors like TSMC and missing key opportunities in generative AI. The company’s declining fortunes have been reflected in a 50% drop in its stock price this year and its recent removal from the Dow Jones Industrial Average.
Intel’s expected $8.5 billion subsidy for expanding its United States chip manufacturing facilities is likely to be reduced, sources revealed. The grants, part of a broader semiconductor funding initiative under the CHIPS and Science Act, will still represent a significant investment but may drop below $8 billion. The adjustment is reportedly linked to Intel’s separate $3 billion Pentagon contract funded through the same programme.
The US government aims to bolster domestic semiconductor production through the CHIPS Act, allocating $52.7 billion overall, including $39 billion in subsidies. Intel’s planned projects in Arizona include building two new chip factories and upgrading an existing facility. Despite these efforts, Intel faces industry challenges, with slumping share prices and restructuring moves under CEO Pat Gelsinger.
Other companies, such as TSMC and GlobalFoundries, have also benefited from preliminary CHIPS Act agreements. Intel’s revised funding agreement is expected soon, with the US Commerce Department declining to comment on the final subsidy figure.
