Semiconductors Archives | Digital Watch Observatory

Growing robotics market positions Qualcomm for next technology wave

Qualcomm expects robotics to become a significant business opportunity within two years, according to chief executive Cristiano Amon. The company is increasingly expanding beyond smartphones as it searches for new long-term growth markets.

Earlier this year, Qualcomm introduced its Dragonwing processor designed specifically for robotics applications. The chipset aims to operate across multiple robotic platforms using a scalable approach similar to its successful mobile processor strategy.

Industry enthusiasm for robotics has grown alongside rapid advances in AI technologies. Often described as ‘physical AI’, these systems allow robots to interpret surroundings and perform complex tasks more effectively.

Market forecasts suggest strong future demand, with analysts predicting robotics could develop into a multi-trillion-dollar global industry. Technology leaders across the semiconductor sector increasingly view intelligent machines as a major next computing platform.

Robotics innovation featured prominently at Mobile World Congress in Barcelona, where companies showcased emerging autonomous machines. Growing investment highlights intensifying competition to shape the future of AI-powered automation worldwide.

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Samsung strengthens Japan 5G rollout with Rakuten Mobile partnership

Samsung has secured an agreement with Rakuten Mobile to deliver Open RAN-compliant 5G radios supporting a nationwide mobile network upgrade across Japan. Commercial deployment is expected to begin in 2026 following extensive testing of the cloud-native infrastructure.

Rakuten Mobile continues to expand its fully virtualised network architecture, designed to improve flexibility, performance, and vendor interoperability. The integration of Samsung equipment demonstrates growing industry confidence in Open RAN technology at large-scale commercial deployments.

Equipment supplied includes low-band and mid-band radios, alongside energy-efficient Massive MIMO systems operating in the 3.8 GHz spectrum. Compact hardware enables easier installation on buildings and street infrastructure while improving capacity in dense urban areas.

Executives from both companies highlighted ambitions to accelerate AI-enabled networks and global Open RAN adoption. Samsung also positioned the partnership as a step toward future 6G innovation and broader next-generation connectivity services.

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Samsung advances AI RAN with NVIDIA breakthrough

The South Korean electronics company, Samsung, has completed a multi-cell test that brings its virtualised RAN software together with accelerated computing from NVIDIA.

A validation that took place in a realistic network environment confirms that the combined architecture is nearing commercial readiness as AI-native networks continue to evolve.

The company plans to highlight the achievement at Mobile World Congress 2026 as part of its broader push toward software-driven networks that use AI instead of fixed hardware optimisation.

Samsung will demonstrate an AI-based MIMO beamformer running on NVIDIA infrastructure, which offers operators higher throughput and improved spectral efficiency by extracting more value from existing spectrum.

NVIDIA and Samsung are also advancing a unified processor design that integrates CPU and GPU within a single chipset, enabling faster and more efficient data exchange.

Recently, Samsung integrated its vRAN software with the NVIDIA ARC Compact platform equipped with the Grace CPU and L4 GPU, taking another step toward commercial AI-RAN deployments.

The firm says that experience from large-scale vRAN rollouts and close collaboration with industry computing partners strengthens its position in delivering AI-powered network platforms for operators worldwide.

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DeepSeek V4 tests China’s AI ambitions against US rivals

China’s DeepSeek is reportedly preparing to release its latest AI model, according to a Financial Times report. The planned debut of the company’s V4 large language model is seen as another test of China’s ability to compete with leading US AI firms.

Sources cited by the report said V4 will be a multimodal model capable of generating images, video, and text. DeepSeek has reportedly worked with Huawei and Cambricon to optimise the model for Chinese AI chips.

The release is expected ahead of the annual Two Sessions parliamentary meetings in China, which begin on 4 March. Analysts say the timing could reinforce DeepSeek’s positioning as a national AI champion.

The launch would be the company’s first major model release since its R1 reasoning system debuted in January last year. DeepSeek claimed R1 matched leading US models while using less computing power, a development some compared to a ‘Sputnik moment’ for American technology firms.

Separately, AI researcher Andrew Ng said the industry remains decades away from achieving artificial general intelligence (AGI). He argued that systems capable of matching human intellectual breadth remain distant, despite steady advances in model performance.

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Qualcomm unveils AI focused wearable chip

Qualcomm has unveiled its Snapdragon Wear Elite chip at MWC 2026 in Barcelona, positioning it for a new wave of AI-driven wearable devices. The company said the processor is aimed at pins, pendants, and potentially display-free smart glasses.

Built on a 3nm process, the chip includes both an eNPU for low-power AI tasks and a Hexagon NPU for heavier on-device processing. Qualcomm said the platform can handle up to two billion parameters locally, supporting more advanced AI features without relying on the cloud.

The Snapdragon Wear Elite is designed to sit alongside the existing W5 Plus rather than replace it. Qualcomm added that the chip improves power efficiency, with GPS tracking using 40 per cent less power and fast charging that delivers around 50 per cent of battery capacity in 10 minutes.

Connectivity features include satellite support, 5G, ultra wideband and Bluetooth 6.0. Qualcomm signalled that longer battery life and on-device AI performance will be central to the next generation of wearable AI gadgets.

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AI data centre boom drives global memory chip shortage

Global demand for AI data centres is creating a severe shortage of memory chips, disrupting supply chains across the consumer electronics industry. Manufacturers warn shortages of RAM could lead to higher prices and delayed shipments for devices including laptops, smartphones and gaming consoles.

Only three companies dominate global RAM production, with capacity increasingly redirected towards high-bandwidth memory used in AI systems. Analysts say rapid investment in AI infrastructure has absorbed available supply faster than manufacturers can expand production facilities.

Major technology firms are already feeling pressure as memory costs rise and inventories tighten. Companies including Apple, HP, Dell and Qualcomm have warned investors that pricing increases and weaker forecasts may follow if shortages persist.

Gaming and computer manufacturers are exploring different responses, ranging from price increases to redesigning products that require less memory. Experts expect supply constraints to continue through the year as chipmakers attempt to balance AI demand with consumer electronics needs.

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Galaxy S26 series brings powerful AI and privacy features

Samsung Electronics has unveiled the Galaxy S26 series, featuring advanced AI experiences, powerful performance, and an industry-leading camera system designed to simplify everyday smartphone tasks.

The series, which includes the Galaxy S26, S26+, and S26 Ultra, handles complex processes in the background, allowing users to focus on results rather than device operations.

The Galaxy S26 Ultra introduces the world’s first built-in Privacy Display, a redesigned chipset, and improved thermal management. Together, these upgrades enhance AI performance, graphics, and CPU efficiency, while ensuring faster, cooler, and more reliable operation throughout the day.

Photography and videography are also upgraded with wider apertures, Nightography Video, Super Steady video, and AI-powered editing tools that make professional-quality content accessible to all users.

Galaxy AI streamlines daily experiences by proactively suggesting actions, organising information, and automating tasks. Features such as Now Nudge, Now Brief, Circle to Search, and upgraded Bixby allow users to interact naturally with their devices.

Integrated AI agents, including Gemini and Perplexity, support multi-step tasks across apps, from booking services to advanced searches, all with minimal input.

Samsung has embedded multiple layers of security and privacy in the Galaxy S26 series. From AI-powered Call Screening and Privacy Alerts to Knox Vault, Knox Matrix, and post-quantum cryptography, users can control data access and protect personal information.

With long-term security updates, seamless software, and Galaxy Buds4 integration, the S26 series aims to combine performance, convenience, and safety in a single, intuitive device.

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Vertical power delivery cuts energy loss in AI processor designs

A EEWorld report explains how vertical power delivery (VPD) architectures are emerging as a response to the escalating power demands of modern AI processors (GPUs, ASICs and accelerators).

Traditional power-delivery networks (PDNs) route current laterally across circuit boards from external voltage regulators, which introduces resistance and inductance losses and generates excess heat, problems that worsen at the very high current levels typical of AI workloads.

In contrast, vertical power delivery relocates DC-DC converters and regulators beneath the processor, reducing the electrical path between the supply and load.

However, this reduces resistance and parasitic inductance, cutting I²R losses and improving transient response, critical for AI chips that experience rapid current shifts during computation. The cleaner power paths also help isolate high-speed signal traces from noise, enhancing signal integrity and electromagnetic compatibility.

Additional benefits include freed top-side board space for memory, optics and other components, which supports higher integration density without expanding board area. However, VPD introduces challenges such as thermal management and height constraints under the processor, requiring advanced packaging and heat-spreading solutions.

Emerging voltage-regulator technologies aim to match the speed of embedded regulators while avoiding their limitations in efficiency and die area consumption.

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Massive chip agreement signals shift in Meta strategy

Meta has committed to purchasing $60bn worth of AI chips from Advanced Micro Devices over five years, signalling one of the largest infrastructure bets in the sector despite ongoing concerns about an AI investment bubble.

The agreement includes a 10% stake in the chipmaker and large-scale deployment of next-generation hardware beginning later this year.

Analysts say the move signals a shift to secure compute capacity and cut reliance on Nvidia amid supply constraints. Talks with Google and ongoing in-house chip work signal a multi-vendor strategy to support expanding data centre operations.

Executives say the investment reflects a shift towards hosting AI workloads and infrastructure services. Custom processors built for performance and efficiency will complement AMD GPUs, supporting capacity expansion as enterprise demand rises.

Enterprise AI competition intensifies as Anthropic and OpenAI expand integrations and tools. Significant platform investments are reshaping semiconductors and signalling strong long-term confidence in AI computing demand.

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AI-driven physics speeds up industrial innovation

PhysicsX, a London-based startup founded by former F1 engineers and AI experts, is redefining engineering with its AI-driven physics platform.

Design and testing cycles are reduced from weeks or months to seconds. Engineers can now iterate rapidly and optimise systems across multiple industries, including aerospace, automotive, semiconductors, energy, and materials.

The technology enables teams to evaluate thousands of design variations simultaneously. Semiconductor firms speed up prototype development, electronics improve thermal performance, and mining boosts copper recovery for renewable energy and AI data centres.

PhysicsX achieves this using Large Physics Models and Large Geometry Models that base design evaluation on real-world physics rather than assumptions.

Predictive reasoning lets engineers simulate multiple parameter changes before acting. The approach shifts control from reactive adjustments to proactive optimisation, helping teams make faster, better-informed decisions.

PhysicsX also bridges disciplinary divides, enabling aerodynamics, structural, and thermal considerations to be optimised together rather than in isolation.

By combining speed, system-level insight, and predictive control, PhysicsX is shrinking the gap between cutting-edge research and practical industrial impact. The platform uses physics-based AI to improve efficiency, drive innovation, and support sustainable growth.

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