The US Department of Commerce has finalised a $6.1B subsidy for Micron Technology, marking one of the largest awards under the CHIPS and Science Act. The funds will support the construction of new semiconductor plants in New York and Idaho, with expectations to create at least 20,000 jobs by the end of the decade.
An additional $275M investment has been earmarked for expanding Micron’s Virginia facility, which focuses on producing chips for critical sectors like defense, automotive, and networking. The White House emphasised that this effort aims to strengthen national security by reducing reliance on foreign suppliers, particularly from China and Taiwan.
The Biden administration has made semiconductor independence a priority, providing similar funding to companies like Intel and Taiwan Semiconductor Manufacturing Co. These initiatives aim to secure the US position in global chip production, a vital industry for technological and economic stability.
China has launched an anti-monopoly investigation into US chipmaker Nvidia, citing possible violations linked to its acquisition of Mellanox Technologies in 2020. The move is widely seen as retaliation against recent US restrictions on China’s semiconductor sector, including curbs on advanced chip exports.
Nvidia, which dominates China’s AI chip market, is accused of breaching conditions tied to the Mellanox deal, such as fair trade requirements and restrictions on bundling products. The probe comes amid heightened trade tensions, with Beijing encouraging local companies to avoid US chips and Washington tightening export controls on critical semiconductor technologies.
Analysts suggest the investigation is unlikely to significantly impact Nvidia in the near term, as its most advanced chips are already restricted from sale in China. However, the company faces growing competition from domestic firms like Huawei. China accounted for 17% of Nvidia’s revenue last year, down from 26% two years prior, as US-China tech conflicts continue to reshape the global semiconductor landscape.
Apple plans to launch its own cellular modem chips next year, starting with the iPhone SE, replacing components from Qualcomm. This marks a significant step towards reducing reliance on the chipmaker, whose modems have powered iPhones for years. Apple aims to phase out Qualcomm’s technology entirely by 2027.
The move follows Apple’s $1 billion acquisition of Intel‘s modem unit in 2019 and its integration of modem design into its chip development team. Additionally, Apple has signed a multi-billion-dollar deal with Broadcom for 5G components.
Qualcomm has acknowledged Apple’s transition but is leveraging advancements in laptops and AI-powered data centres to offset expected revenue declines. Investors and suppliers like Skyworks Solutions and Qorvo are closely monitoring the impact of Apple’s strategy on their business.
A Rotterdam court is set to hold a pretrial hearing on Monday concerning a former Russian employee of ASML accused of stealing intellectual property from the Dutch semiconductor equipment maker. The suspect, a 43-year-old Russian national, allegedly profited by selling company manuals, including those of ASML’s Mapper subsidiary, to Russian buyers, according to Dutch media reports.
ASML, which acquired Mapper in 2019, confirmed its awareness of the case and said it had filed a formal complaint, declining further comment during ongoing legal proceedings. The suspect is reportedly in custody, though details of the arrest remain unclear.
Mapper, a Dutch firm focused on developing E-beam lithography technology, was integrated into ASML following its 2019 bankruptcy. While Mapper’s product did not succeed, its engineers joined ASML’s chip-measuring business, helping to bolster the company’s capabilities. This acquisition eased concerns about sensitive technology falling into foreign hands, a priority for both the Dutch government and the US military.
Taiwan Semiconductor Manufacturing Co (TSMC) is negotiating with Nvidia to produce its Blackwell AI chips at TSMC’s new plant in Arizona, according to insider sources. The Blackwell chips, unveiled in March, are designed for generative AI and accelerated computing, boasting speeds up to 30 times faster for tasks like chatbot responses. Production at the Arizona facility is expected to commence next year.
While TSMC will handle the front-end chip production in Arizona, the chips will require shipment back to Taiwan for essential packaging. Arizona’s plant lacks chip-on-wafer-on-substrate (CoWoS) capacity, which is crucial for Blackwell chips. TSMC currently reserves all CoWoS operations for its Taiwan facilities.
The agreement, if finalised, would expand the client base of TSMC’s Arizona site, which already counts Apple and Advanced Micro Devices among its customers. Neither TSMC nor Nvidia commented on the ongoing discussions, and Apple and AMD have yet to respond to inquiries.
TSMC’s investment in Arizona includes three advanced facilities, supported by US government subsidies aimed at revitalising domestic semiconductor production. The collaboration with Nvidia highlights the increasing global demand for AI chip technology.
French electrical firm Schneider Electric has teamed up with Nvidia to develop cutting-edge cooling systems for AI-focused data centres. These designs will cater to Nvidia’s powerful AI servers, which feature 72 advanced chips and are set to debut next year.
The energy-intensive servers, consuming up to 132 kilowatts per rack, necessitate liquid cooling technology. Schneider‘s scalable solutions will support various configurations for cloud computing firms and data centre customers, enhancing adaptability and efficiency in AI infrastructure.
Schneider’s push into AI data centres follows a $3 billion deal with Compass Datacenters in 2023, underlining its commitment to innovative technologies. Nvidia‘s switch to liquid cooling has spurred significant developments in data centre construction and upgrades, driving collaboration with industry leaders.
Amazon Web Services (AWS) has revealed advanced data centre servers powered by its in-house Trainium2 AI chips, marking a significant step in its efforts to rival Nvidia in the AI hardware market. The servers will form the backbone of a vast supercomputer designed to handle complex AI workloads, incorporating hundreds of thousands of Trainium2 chips. AI startup Anthropic will be the first to utilise the new system, highlighting its capabilities for AI research and deployment.
Apple has also confirmed its adoption of Trainium2 chips, underscoring the growing appeal of Amazon’s AI hardware in the competitive tech landscape. AWS CEO Matt Garman added that the Trainium3 chip, the next evolution in the series, will debut in 2024. This aligns with Amazon’s broader strategy to dominate AI technology, offering cutting-edge solutions for both startups and major corporations.
The announcement comes as Amazon intensifies efforts to challenge Nvidia, currently a leader in AI chip manufacturing. AWS‘s growing presence in the sector aims to meet surging demand for AI processing power while providing alternatives to established providers. These advancements not only strengthen Amazon’s position in AI technology but also attract major industry players like Apple, which is leveraging the chips to enhance its data operations.
In recent years, China and Russia have significantly ramped up efforts to advance their semiconductor equipment industries, aiming to secure competitive positions in the global market. While the US, Netherlands, Japan, and South Korea dominate the semiconductor equipment sector, China’s aggressive R&D investments in etching, CVD, PVD, and packaging technologies are helping it make strides in domestic substitution. However, the country still lags in high-end lithography equipment, especially EUV machines.
Despite challenges, China’s semiconductor equipment market is expected to see record-high purchases in 2024, surpassing $40 billion. Experts attribute this growth to localisations, new fabs, and global supply chain concerns. However, demand is expected to stabilise in 2025 once production lines are up and running, although long-term growth remains promising, fueled by applications in 5G, AI, and automotive electronics.
Meanwhile, Russia has accelerated its efforts to develop domestic semiconductor equipment, receiving over $2.5 billion in government funding. With a focus on manufacturing 200mm wafers for chips with nodes from 180nm to 90nm, Russia aims to reduce reliance on imports. The country’s ambitious goal is to replace 70% of imported equipment with domestically produced alternatives by 2030. Despite progress, Russian manufacturers like Angstrem and Mikron are still constrained to mature process nodes, depending on imported lithography systems.
Taiwan Semiconductor Manufacturing Company (TSMC) is reportedly in discussions with Nvidia to produce its Blackwell AI chips at TSMC’s new facility in Arizona, according to sources familiar with the matter. This move would mark a significant expansion of Nvidia’s chip production outside Taiwan, where the Blackwell series has been manufactured since its unveiling in March. The chips, celebrated for their generative AI and accelerated computing capabilities, are in high demand and boast speeds 30 times faster than previous models for tasks like chatbot responses.
The Arizona facility, set to begin volume production next year, represents a major US investment by TSMC, which is building three plants in Phoenix with substantial US government subsidies. If finalised, Nvidia would join Apple and AMD as plant customers. However, sources indicate that the chips would still need to be sent back to Taiwan for advanced packaging due to the lack of chip-on-wafer-on-substrate (CoWoS) capacity in Arizona. All of TSMC’s CoWoS operations remain centralised in Taiwan.
TSMC’s expansion into the US aligns with Washington’s push to bolster domestic semiconductor manufacturing amid geopolitical concerns over Taiwan. Neither TSMC nor Nvidia has commented on the talks, emphasising the confidentiality of the ongoing discussions.
Malaysia has cautioned that US President-elect Donald Trump’s proposed tariffs on BRICS nations could disrupt the global semiconductor supply chain. Trump has warned of 100% tariffs on BRICS members unless they halt efforts to create a new currency or reduce reliance on the US dollar, a move Malaysia’s trade minister, Tengku Zafrul Aziz, says could harm both sides.
The United States is Malaysia’s third-largest trade partner, and US firms are key investors in Malaysia’s semiconductor industry, which handles 13% of global chip testing and packaging. Tengku Zafrul emphasised that supply chain stability depends on cooperation, not protectionist measures.
While BRICS countries have discussed alternatives to the dollar, no official decision has been made. Malaysia has applied to join the bloc but is not yet a member. Meanwhile, Russia argued that US pressure would only accelerate global moves toward national currencies in trade.
