Samsung gains ground in AI memory chip development
These advancements come after a period of development missteps and internal restructuring, including replacing the head of the semiconductor division.
Samsung Electronics is making strides in developing memory chips essential for the AI market, narrowing the gap with rival SK Hynix. The company has recently received approval from Nvidia for its HBM3 memory chips and anticipates approval for its next generation, HBM3E, within months. The advancement follows months of setbacks, including development challenges and replacing the head of its semiconductor division.
Samsung’s efforts come as the demand for high-bandwidth memory (HBM) is expected to soar, driven by AI advancements. The HBM market is projected to grow from $4 billion in 2022 to $71 billion by 2027. Nvidia’s approval is crucial for Samsung to capitalise on this booming market and improve its revenue and market share despite still trailing SK Hynix.
Why does this matter?
The company has faced significant engineering challenges, particularly with the thermal management of the stacked DRAM chips used in HBM. Under the leadership of Jun Young-hyun, Samsung has focused on resolving these issues and enhancing its technology. The company has also reorganised its HBM team to boost innovation and collaboration.
As Samsung progresses, it aims to ramp up production and meet the growing demand for AI memory chips. With its financial resources and production capacity, the company is well-positioned to address market shortages and secure a significant share of the lucrative AI memory market.
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