NVIDIA and TSMC celebrate first US-made Blackwell AI chip
The NVIDIA Blackwell wafer’s production in Arizona strengthens the US’s semiconductor supply chain and cements its role in the global AI technology race.
A collaboration between NVIDIA and TSMC has marked a historic milestone with the first NVIDIA Blackwell wafer produced on US soil.
The event, held at TSMC’s facility in Phoenix, symbolised the start of volume production for the Blackwell architecture and a major step toward domestic AI chip manufacturing.
NVIDIA’s CEO Jensen Huang described it as a moment that brings advanced technology and industrial strength back to the US.
A partnership that highlights how the companies aim to strengthen the US’s semiconductor supply chain by producing the world’s most advanced chips domestically.
TSMC Arizona will manufacture next-generation two-, three- and four-nanometre technologies, crucial for AI, telecommunications, and high-performance computing. The process transforms raw wafers through layering, etching, and patterning into the high-speed processors driving the AI revolution.
TSMC executives praised the achievement as the result of decades of partnership with NVIDIA, built on innovation and technical excellence.
Both companies believe that local chip production will help meet the rising global demand for AI infrastructure while securing the US’s strategic position in advanced technology manufacturing.
NVIDIA also plans to use its AI, robotics, and digital twin platforms to design and manage future American facilities, deepening its commitment to domestic production.
The companies say their shared investment signals a long-term vision of sustainable innovation, industrial resilience, and technological leadership for the AI era.
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