US trade sanctions on Huawei may spur innovation in the Chinese chip market
Under pressure from trade sanctions put in place by the United States, Chinese Telecommunications Company Huawei is seeking to remain competitive by investing in innovation.
The company filed a patent application in the field of semiconductor packaging for a ‘a type of chip stacking package and terminal device’ which uses through-chip via technology (also known as through-silicon via or TSV).
The technology is expected to enable stacked chips to interconnect through direct contact, providing high-speed signal processing and improved photo detection for image sensing. One of the goals is to ease the disruptions caused by US chip sanctions on the firm’s operations.