TSMC targets AI future with advanced chip designs
The A14 chip, expected in 2028, is already ahead of schedule in development and performance testing.
Taiwan Semiconductor Manufacturing Co. (TSMC) has introduced its cutting-edge A14 logic process technology at its North America Technology Symposium, held in Santa Clara, California.
The A14 process, touted as a major leap from its N2 predecessor, is aimed at enhancing AI capabilities through faster computing speeds and greater power efficiency. TSMC expects the A14 to enter production in 2028 and reports that development is ahead of schedule in terms of yield performance.
Alongside the A14, TSMC revealed significant advances in its Chip on Wafer on Substrate (CoWoS) technology, crucial for meeting AI’s growing demands for processing power and high-bandwidth memory.
A new SoW-X platform, based on CoWoS and capable of 40 times more computing power than current solutions, is slated for mass production in 2027. The company also confirmed plans to scale up its 9.5 reticle size CoWoS for volume production in the same year.
TSMC continues to broaden its innovation pipeline with developments across various domains, including 3D chip stacking and advanced packaging. It also unveiled the N4C RF, its latest radio frequency technology designed to support upcoming standards like WiFi8 and AI-powered audio platforms.
Risk production of the N4C RF is expected in early 2026, as TSMC strengthens its foothold in high-performance computing, mobile, automotive, and IoT markets.
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