SK Hynix to commence mass production of advanced HBM3E 12-layer chips by end of month
HBM is a critical component for GPUs used in AI applications, thanks to its ability to handle vast amounts of data efficiently.
SK Hynix, the world’s second-largest memory chip maker, is set to begin mass production of its advanced HBM3E 12-layer chips by the end of this month. This announcement was made by Justin Kim, president and head of the company’s AI Infra division, during the Semicon Taiwan industry forum in Taipei. The South Korean company had previously revealed plans to ship these chips in the fourth quarter, with the next generation, HBM4, expected to launch in the second half of 2025.
High bandwidth memory (HBM) is a dynamic random access memory (DRAM) type that stacks chips vertically, allowing for greater space efficiency and lower power consumption. These advanced memory chips are crucial for processing large amounts of data in generative AI applications, making them an essential component of graphics processing units (GPUs) used in AI.
SK Hynix, along with Micron and Samsung Electronics, is a key player in the HBM market. The company has been a major supplier of HBM chips to Nvidia and has already provided HBM3E chips to an undisclosed customer earlier this year. According to SK Hynix CEO Kwak Noh-Jung, the company’s HBM chips are sold out for 2024 and nearly sold out for 2025, highlighting the high demand for these advanced memory solutions.
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