Standard ECMA-342 RapidIO™ interconnect specification

Summary

RapidIO is a high-performance, packet-switched interconnect designed for chip-to-chip and board-to-board communication, commonly used in networking, memory systems, and general-purpose computing. It supports distributed memory systems where devices use DMA engines to exchange data. The architecture is divided into three layers: logical, transport, and physical. The logical layer defines protocols and transaction formats, supporting various programming models, including message passing. The transport layer handles packet delivery, ensuring compatibility and flexibility across implementations. The physical layer specifies the interface between devices, focusing on signal definitions, flow control, and error management. RapidIO is optimized for performance, supporting large data payloads, efficient packet assembly, and concurrent transactions, with features designed for scalability and reliability across diverse systems.